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CNC-Leichtbauteil
CNC-Leichtbauteil
CNC-Leichtbauteil

CNC-Leichtbauteil

Die in den von uns gelieferten astronomischen Teleskopreflektoren verwendeten Materialien erfüllen typischerweise die folgenden Anforderungen: 1. Niedriger Wärmeausdehnungskoeffizient 2. Spannungsarme Doppelbrechung 3. Feine Temperung 4. Stabile optische Leistung 5. Effektive Kontrolle von Blasen und Schlieren.

Optionale Substratmaterialien
  • Silicon
    Silicon

    Core materials for infrared detectors: Sensitive to specific infrared bands, used to detect cold, dark celestial bodies, exoplanets, etc., and applied to infrared astronomical observations.

  • Silicon carbide
    Silicon carbide

    Large/Cryogenic mirror blanks: High rigidity, lightweight, and good thermal conductivity, maintaining shape stability at low temperatures.

  • Fused silica(JGS2)
    Fused silica(JGS2)

    High-performance diffraction gratings: Wide transmission band, good thermal stability, and radiation resistance, enabling high-efficiency, wide-band spectral dispersion.

  • ZERODUR® (Schott)
    ZERODUR® (Schott)

    Primary/secondary mirror substrates for extreme telescopes: With a near-zero coefficient of thermal expansion, maintaining mirror shape stability under extreme temperature differences, ensuring image sharpness.

Probe


Typische Anwendungsgebiete
  • Low-Altitude Economy and Aerospace
    Low-Altitude Economy and Aerospace
    This is the most cutting-edge and demanding field for CNC lightweight component applications. Every gram reduction in weight for drones and aerospace vehicles can mean longer range, greater payload, or lower energy consumption.
  • High-End Industrial Machine Tools and Semiconductor Equipment
    High-End Industrial Machine Tools and Semiconductor Equipment
    Manufacturing lithography machine worktables, precision measurement platforms, and high-rigidity tooling systems.
  • Precision Inspection and Automation
    Precision Inspection and Automation
    Precision structural components and optical elements for machine vision systems, LiDAR, and 3D scanners.
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