Name: Saphirglas
Rating: 4.5 (100 reviews)

Hauptmerkmale

Extreme Mechanical Strength

It is one of the hardest materials after diamond, possessing extremely high compressive strength, scratch resistance, and the ability to withstand harsh environments such as high pressure and high-speed impacts.
Excellent Physicochemical Stability

Chemically extremely stable, resistant to strong acids, and does not absorb hydroxyl groups (OH groups) near 1.4μm, 2.2μm, and 2.7μm, making it suitable for chemical analysis instruments. Its melting point is as high as 2053°C, allowing it to withstand extremely high temperatures.
Excellent Thermal Management

With a higher thermal conductivity than fused silica, it dissipates heat more quickly in high-power laser applications, effectively reducing focus drift caused by thermal effects.
$Wide Transmission Range and High Refractive Index$
Wide Transmission Range and High Refractive Index

Its transmission band covers ultraviolet, visible, and mid-infrared light (approximately 0.15μm - 5.5μm). Its high refractive index (approximately 1.77) allows for thinner and lighter lenses with the same focal length.

Spezifikation von Saphirglas

Kristallographische	Syngonie	Tetragon
	Symmetrieklasse	3 m
	Gitterkonstanten	a = 4,758 Å c = 12,991 Å
	Spaltbarkeit	(1011), (1120) unvollkommen
Optische	Brechungsindex bei ne	1,7771
	Brechungsindex bei nF' - nC'	0,0107
	Thermischer Brechungsindexkoeffizient bei 3,39 Mikrometern für ±60 °C	βo = (0,88 ... 1,28) x 10-5 βe = (0,99 ... 1,39) x 10-5
	Spektralbereich, Mikrometer	0,17 - 5,0
Thermal	Thermische Längenausdehnung, °C-1 für ±60 °C
	⊥ zur c-Achse	(3,24 ... 5,66) x 10-6
	Wärmeleitfähigkeit, W/(m * °C) bei 46 °C
	⊥ zur c-Achse	25.2
	\|\| zur c-Achse	23.1
	Spezifische Wärmekapazität, J/(kg * °C)	0,7610 x 103
	Thermische Stabilität, °C	162 ±8
	Schmelzpunkt, °C	2030
Chemische	Molekulargewicht	101,96
Chemische	Löslichkeit in Wasser, Gramm/100 cm³	98 x 1010

Typische Anwendungsgebiete

High-power laser processing

Cutting and welding systems using 1μm fiber lasers, leveraging their low thermal drift and high damage threshold to improve processing quality and stability.
Extreme environment detection

Windows or lenses in aerospace, deep-sea exploration, and oil drilling equipment need to withstand high pressure, high temperature, vibration, and corrosion.
Spectroscopic and chemical analysis

Near-infrared analytical instruments, due to their non-absorption of hydroxyl groups, can accurately measure spectra in relevant wavelength bands.
Medical and semiconductor

Medical endoscopes and semiconductor ultraviolet lithography equipment require materials that are non-toxic and can withstand harsh processes.